Dynamic Response Simulation of Ultrasonic Wire Bonding for Power Semiconductors

Industry of customer: Industrial Automation & Motion Control

Location of customer: Germany

Period of time: 2021/22

Content of the job:

  • Create a simulation model from CAD data
  • Dynamic Response Simulation (static preload, linear sweep force vs. frequency)
  • Calculation of displacement vs. frequency at the pins
  • design changes to improve the performance